Electronics MFG Capabilities (2)

This list is always updating and we work to make sure we offer what our customers desire.

| P-EN-7.2-03 KE-Jasper Data Requirements Procedure | Data Requirements Quick Checklist |

Assembly

  • Automated Through-Hole
  • Through-Hole Reflow (THR)
  • Paste & Glue Bottom Side (SMD)
  • Pin Insertion (Press Fit Pin)
  • Compliant Pin (Press Fit Connector)
  • Conformal Coating - Spray & Dip
  • Potting
  • Vibration Welding
  • Preforming
  • Cable and Harness Assembly
  • Box Build
  • Subassembly and System Build

Pick and Place

  • 0201,0402, and 0603
  • 12, 16, and 20 Mil Pitch
  • BGA and Mini BGA
  • Pin In Paste

Screen Printing

  • Step Stencil (Cross Over)
  • Lead Free

Flux Application

  • Spray and Adhesives
  • Ultrasonic VOC

Testing

  • Electromechanical Assembly & Test
  • Electronic Assembly and Test
  • Leak Test
  • Strain Test

Soldering

  • Selective
  • No Clean Process
  • Lead Free Hi Temperature
  • Nitrogen Wave
  • Nitrogen Reflow
  • Soldering Point

Reflow

  • 2 Sided SMT Reflow
  • Nitrogen SMD Reflow
  • Lead Free

Depaneling

  • Router
  • V-Cut
  • Punch

Inspection

  • Automated Optical (AOI)
  • Automated X-Ray (AXI)
  • 2D Automated Solder Paste
  • 3D Automated Solder Paste
  • Offline X-Ray
  • Cross Section
  • Coordinate Measuring Machine

Rework

  • BGA Rework Station

General

  • High Volume Flash Programming
  • Labeling
  • Packaging
  • Lean Line Design Ability